Semiconductor device

ABSTRACT

A semiconductor device is provided that is capable of reducing the possibility of change in state of memory elements formed over a semiconductor substrate with an insulating layer interposed therebetween. The semiconductor device includes nonvolatile memory elements and a bias circuit. Each of the nonvolatile memory elements includes a drain region and a source region arranged so as to sandwich a semiconductor region where a channel is formed, a gate electrode, and a charge storage layer arranged between the gate electrode and the semiconductor region. The nonvolatile memory elements are arranged over the semiconductor substrate with the insulating layer interposed therebetween. When electrons are stored in the charge storage layer, the bias circuit reduces the potential difference between the gate electrode and at least one of the drain region and source region in order to decrease holes stored in the channel of a nonvolatile memory element.

CROSS-REFERENCE TO RELATED APPLICATIONS

The disclosure of Japanese Patent Application No. 2016-154630 filed onAug. 5, 2016 including the specification, drawings and abstract isincorporated herein by reference in its entirety.

BACKGROUND

This invention relates to semiconductor devices, and more particularlyto a semiconductor device including electrically-rewritable nonvolatilememory elements formed over a semiconductor substrate with an insulatinglayer interposed therebetween.

A semiconductor device equipped with an electrically-rewritablenonvolatile memory, such as a so-called EEPROM and flash memory, isdisclosed in, for example, Japanese Unexamined Patent ApplicationPublication No. 2015-103555. In the Japanese Unexamined PatentApplication Publication No. 2015-103555, metal oxide nitride oxidesemiconductor (MONOS) transistors are employed as memory cells(hereinafter, referred to as nonvolatile memory elements or simply,memory elements) that make up the EEPROM or flash memory. It isdescribed that such an EEPROM or flash memory can be written and erasedusing Fowler-Nordheim tunneling phenomenon, hot electrons, or hot holes.

In addition, the Japanese Unexamined Patent Application Publication No.2015-103555 discloses silicon-on-thin-buried-oxide (SOTB) transistorsformed over a silicon-on-insulator (SOI) substrate.

SUMMARY

The inventors of the present invention have devised a memory elementconfigured like the MONOS transistor formed over a SOI substrate in asimilar manner as the SOTB transistor. The resultant product has aninsulating layer between the semiconductor substrate and the memoryelement, thereby decreasing the parasitic capacitance of thesemiconductor substrate, which is inherent in the memory element.Consequently, the memory element can provide, for example, improvedoperational speed.

The inventor fabricated memory elements over a SOI substrate in the samemanner as the SOTB transistors, and performed evaluations on the memoryelements during write operation. However, the evaluation results showedthat the memory elements had a relatively short erroneous erase lifetimein comparison with memory elements formed over a semiconductorsubstrate. Specifically, the evaluations found a new problem that theerroneous erase lifetime, which is a period up to when a written memoryelement is determined to be erased, is very short in comparison with thememory elements formed over the semiconductor substrate. This newproblem is not disclosed in the aforementioned Japanese UnexaminedPatent Application Publication No. 2015-103555.

Other problems and novel features of the present invention will becomeapparent from the following description in the specification and theaccompanying drawings.

The semiconductor device according to an embodiment includes a pluralityof memory elements and a bias circuit. Each of the memory elementsincludes a pair of second semiconductor regions arranged to sandwich afirst semiconductor region where a channel is formed, the secondsemiconductor regions being of a first conductivity type, a gateelectrode arranged above the first semiconductor region, and a chargestorage layer arranged between the gate electrode and the firstsemiconductor region and storing charge. The memory elements arearranged over a semiconductor substrate with an insulating layerinterposed therebetween. When majority charge carriers of the firstconductivity type are stored in the charge storage layer of a firstmemory element in the memory elements, the bias circuit reduces thepotential difference between the gate electrode of a second memoryelement, which is different from the first memory element, and at leastone of the second semiconductor regions to thereby reduce majoritycharge carrier of a second conductivity type, which is different fromthe first conductivity type, stored in the channel of the second memoryelement.

This embodiment can provide a semiconductor device capable of reducingthe possibility of change in state of the memory elements formed overthe semiconductor substrate with the insulating layer interposedtherebetween.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram showing the configuration of a flash memoryaccording to the first embodiment.

FIG. 2 is a schematic waveform diagram to describe the operation of theflash memory according to the first embodiment.

FIGS. 3A to 3C are schematic cross-sectional views showing theconfiguration of a memory element according to the first embodiment.

FIG. 4 is a waveform diagram showing waveforms during a write operationperformed on the flash memory according to the first embodiment.

FIGS. 5A and 5B are characteristic diagrams, respectively showing theelectric field variations of an unselected memory element according tothe first embodiment, and the charge variations of the unselected memoryelement.

FIG. 6 is a waveform diagram showing waveforms during a write operationperformed on a flash memory according to the second embodiment.

FIG. 7 is a waveform diagram showing waveforms during a write operationperformed on a flash memory according to the third embodiment.

FIG. 8 is a waveform diagram showing waveforms during a write operationperformed on a flash memory according to the fourth embodiment.

FIG. 9 is a block diagram showing the configuration of a semiconductordevice according to the first embodiment.

FIG. 10 is a circuit diagram to describe a new problem found by theinventors of the present invention.

FIGS. 11A and 11B are diagrams to describe the new problem.

DETAILED DESCRIPTION

With reference to the accompanying drawings, embodiments of the presentinvention will be described below. In all the drawings to describe theembodiments, the same reference numerals and letters are assigned to thesame components in principle, and explanations thereof will not berepeated.

First Embodiment

In order to make it easier to understand the embodiments, firstly,description will be made about a new problem arising when memoryelements are formed over a semiconductor substrate with an insulatinglayer interposed therebetween.

New Problem

FIG. 10 is a circuit diagram to describe the new problem found by theinventors of the present invention. A plurality of memory elements arearranged in a matrix, and each of the memory elements are formed over asemiconductor substrate with an insulating layer interposedtherebetween. In plan view, the memory elements are arranged in a matrixover the insulating layer, and the semiconductor substrate is arrangedbelow the insulating layer. FIG. 10 shows four memory elements numberedMC (00) to MC (11) among the memory elements arranged in a matrix. InFIG. 10, for example, the memory elements MC (00) and MC (01) arealigned along the 0 th row of the matrix, while the memory elements MC(10) and MC (11) are aligned along the 1st row of the matrix. Whenviewed along columns in the matrix, the memory elements MC (00) and MC(10) are aligned along the 0 th column, while the memory elements MC(01) and MC (11) are aligned along the 1st column.

Each of the memory elements MC (00) to MC (11) includes a MONOStransistor MTr. Since all the memory elements MC (00) to MC (11) havethe same structure, the explanation of the structure will be made usingthe memory element MC (00) as an example. The MONOS transistor MTrmaking up the memory element MC (00) includes a source region S, a drainregion D, a gate electrode G, and a back gate BK. In addition, N in FIG.10 denotes a charge storage layer in which charge is stored. The gateelectrode G of the MONOS transistor is coupled to a word line WL (0)arranged along the 0 th row of the matrix, the source region S iscoupled to a source line SL (0) arranged along the 0 th column of thematrix, and the drain region D is coupled to a bit line BL (0) arrangedalong the 0 th column of the matrix. The back gate BK is coupled to aback gate line BKL.

The MONOS transistor MTr described herein is an N-channel transistor,but this is just an example. Accordingly, a pair of N-type semiconductorregions are arranged so as to sandwich a P-type semiconductor regionformed over the insulating layer. One of the N-type semiconductorregions serves as the drain region D and is coupled to the bit line BL(0), and the other serves as the source region S and is coupled to thesource line SL (0). Over a main surface of the P-type semiconductorregion sandwiched by the N-type semiconductor regions formed is a gateinsulating layer, and the charge storage layer N is formed over the gateinsulating layer. The charge storage layer N is made of, for example, anitride film, and a conductive layer making up the gate electrode G isformed above the charge storage layer N made of the nitride film. Aninsulating layer is interposed between the charge storage layer N andthe conductive layer. In short, an insulating layer, nitride film,insulating layer, and conductive layer are stacked on the upper side ofthe P-type semiconductor region.

For instance, application of a voltage to the gate electrode G createsan electric field that forms a channel in the P-type semiconductorregion. The channel is also formed in the P-type semiconductor regionwith an electric field created by the back gate line BKL. Since theP-type semiconductor region where the channel is formed is thin, thesemiconductor substrate located on the opposite side of the P-typesemiconductor region with respect to the insulating layer is used as theback gate line BKL. Specifically, the P-type semiconductor region iselectrically isolated from the semiconductor substrate by the insulatinglayer, and is electrically floating; however, application of a voltageto the semiconductor substrate (back gate line BKL) can change thevoltage in the P-type semiconductor region.

The voltage to be applied is what determines which of the N-typesemiconductor regions included in the MONOS transistor MTr serves as thesource region S or drain region D. In this specification, the N-typesemiconductor region coupled to the source line SL (0) is assumed as thesource region S, and the N-type semiconductor region coupled to the bitline BL (0) is assumed as the drain region D.

The remaining memory elements MC (01) to MC (11) have the same structureas the memory element MC (00); however, they are coupled to differentword lines, bit lines, and source lines. Specifically, the MONOStransistor MTr of the memory element MC (01) is coupled to the word lineWL (0) in the 0 th row, the bit line BL (1) in the 1st column, and thesource line SL (1) in the 1st column. The MONOS transistor MTr of thememory element MC (10) is coupled to the word line WL (1) in the 1strow, the bit line BL (0) in the 0 th column, and the source line SL (0)in the 0 th column. The MONOS transistor MTr of the memory element MC(11) is coupled to the word line WL (1) in the 1st row, the bit line BL(1) in the 1st column, and the source line SL (1) in the 1st column.

The memory elements MC (00) to MC (11) are memory elements of aso-called flash memory. Data is written to or erased from a desiredmemory element (MONOS transistor MTr) by selecting a word line, bitline, and source line coupled to the desired memory element and applyinga selection voltage to the selected word line, bit line, and sourceline. In addition, selection of a word line, bit line, and source linecoupled to a desired memory element and application of a selectionvoltage to the selected word line and source line enable reading of datastored in the desired memory element through the selected bit line. Inwrite operation or erase operation, a non-selective voltage is appliedto unselected word line, bit line, and source line. In also readoperation, a non-selective voltage is applied to the unselected wordline and source line.

Next, description will be made about write operation performed to adesired memory element using Fowler-Nordheim tunneling. In thisspecification, electrons are injected into the charge storage layer N ofa memory element (MONOS transistor) in write operation. The state wherethe electrons are stored in the charge storage layer N is assumed as astate where data has been written in the memory element. In this case,since the MONOS transistor is an N-channel transistor, the thresholdvoltage of the memory element is high.

FIGS. 11A and 11B are diagrams to describe the new problem. FIG. 11A isa waveform diagram of voltages on the word lines, bit lines, sourcelines, and back gate line shown in FIG. 10. FIG. 11A shows waveformswhen a write operation is performed on the memory element MC (00). InFIG. 11A, the horizontal axis indicates time t, while the vertical axisindicates voltage on each line. In addition, Vs, which is indicated by adashed line in FIG. 11A, denotes a ground voltage of the circuit. Thevoltage over the dashed line indicates that it is positive with respectto the ground voltage Vs, while the voltage below the dashed lineindicates that it is negative with respect to the ground voltage Vs.

To write the memory element MC (00), the word line WL (0), source lineSL (0), and bit line BL (0) coupled to the memory element MC (00) areselected, and the remaining word line WL (1), source line SL (1), andbit line BL (1) are unselected. In the write operation usingFowler-Nordheim tunneling, as shown in FIG. 11A, a positive voltage isapplied to the word line WL (0) that is selected, and a negative voltageis applied to the bit line BL (0) and source line SL (0) that are bothselected. Through the voltage application, electrons are injected fromthe channel of the MONOS transistor MTr of the memory element MC (00) tothe charge storage layer (nitride film) N. The injected electrons arestored in the charge storage layer N, thereby increasing the thresholdvoltage of the memory element MC (00).

To prevent the memory elements MC (01) to MC (11) from being written andbeing erased during the write operation to the memory element MC (00),as shown in FIG. 11A, a positive voltage is applied to the word line WL(1), bit line BL (1), and source line SL (1) that are all notunselected. Hereinafter, the word line, bit line, and source line thatare selected are also referred to as a selected word line, selected bitline, and selected source line. The word line, bit line, and source linethat are not selected are also referred to as an unselected word line,unselected bit line, and unselected source line.

If the memory element MC (00), which is selected to be written, isdefined as a selected memory element (first memory element), the memoryelements MC (01) to MC (11), except for the memory element MC (00), aredefined as memory elements that are not selected (hereinafter, alsoreferred to as unselected memory elements). The unselected memoryelements can be classified into three types. Specifically, theunselected memory elements can be classified into a write-protectedmemory element WIS, an erroneously-writable memory element WPS, and anerroneously-erasable memory element EPS. The reference letters SLS inFIG. 10 indicate the classification type of the selected memoryelements.

The write-protected memory element WIS is an unselected memory elementcoupled to the same word line to which the selected memory element SLSis coupled, that is, the selected word line WL (0). This write-protectedmemory element WIS corresponds to the memory element MC (01) in FIG. 10,and a positive voltage is applied to the word line WL (0), while anegative voltage is applied to the bit line BL (1) and source line SL(1). In other words, a positive voltage is applied to the gate electrodeG of the MONOS transistor MTr of the memory element MC (01), while anegative voltage is applied to the drain region D and source region S.

The erroneously-writable memory element WPS is an unselected memoryelement coupled to the bit line SL (0) and source line SL (0), which arethe same lines to which the selected memory element SLS is coupled. Thiserroneously-writable memory element WPS corresponds to the memoryelement MC (10) in FIG. 10, and a negative voltage is applied to theword line WL (1), while a negative voltage is applied to the bit line BL(0) and source line SL (0). In other words, a negative voltage isapplied to the gate electrode G of the MONOS transistor MTr of thememory element MC (10), and a negative voltage is applied to the drainregion D and source region S, too.

The erroneously-erasable memory element EPS is an unselected memoryelement (second memory element) coupled to an unselected word line, anunselected bit line, and an unselected source line, and also is anunselected memory element that does not share any word line, bit line,and source line with the selected memory element SLS. Thiserroneously-erasable memory element EPS corresponds to the memoryelement MC (11) in FIG. 10, and a negative voltage is applied to theword line WL (1), while a positive voltage is applied to the bit line BL(1) and source line SL (1). In other words, a negative voltage isapplied to the gate electrode G of the MONOS transistor MTr of thememory element MC (11), while a positive voltage is applied to the drainregion D and source region S.

Although FIG. 10 shows only the four memory elements MC (00) to MC (11),a plurality of unselected memory elements aligned in the same row as aselected memory element SLS in the matrix are classified as thewrite-protected memory element WIS, and a plurality of unselected memoryelement aligned in the same column as the selected memory element SLS inthe matrix are classified as the erroneously-writable memory elementWIS. In addition, a plurality of unselected memory elements arrangedindifferent rows and columns from the selected memory element SLS in thematrix are classified as the erroneously-erasable memory element EPS.Viewing the matrix, the number of unselected memory elements classifiedas the erroneously-erasable memory element EPS is greater than thenumber of the unselected memory elements of the other two types.

In the case where the memory elements arranged in a matrix are composedof MONOS transistors formed over a semiconductor substrate, it ispossible to prevent the unselected memory elements from being writtenand erased by applying an appropriate voltage to the selected word line,selected bit line, selected source line, unselected word line,unselected bit line, and unselected source line during write operationto the selected memory element.

On the contrary, in the case where the memory elements are composed ofMONOS transistors formed over a semiconductor substrate with aninsulating layer interposed therebetween, the inventors found throughevaluations that the erroneous erase lifetime of the unselected memoryelement classified as the erroneously-erasable memory element EPS isshortened. FIG. 11B is a characteristic diagram of threshold voltagevariations over time of a memory element classified as theerroneously-erasable memory element EPS (e.g., the memory element MC(11) in FIG. 10). The horizontal axis in FIG. 11B indicates time t, andthe vertical axis indicates threshold voltage Vth of the memory elementMC (11). In FIG. 11B, the solid line BK is a characteristic curveshowing the threshold voltage variations of the unselected memoryelement MC (11) when MONOS transistors MTr making up the memory elementsMC (00) to MC (11) are formed over a semiconductor substrate. The dashedline SO is a characteristic curve showing threshold voltage variationsof the unselected memory element MC (11) when the memory elements MC(00) to MC (11) are formed over a semiconductor substrate with aninsulating layer interposed therebetween, as described with reference toFIG. 10.

In the case of the memory elements MC (00) to MC (11) formed over asemiconductor substrate, when a write operation is performed on theselected memory element MC (00), or more specifically, when electronsare injected into the charge storage layer N of the MONOS transistor MTrof the selected memory element MC (00) to accumulate the charge in thecharge storage layer N, the threshold voltage Vth of the memory elementMC (11) formed over the semiconductor substrate changes a little asindicated by the characteristic curve BK, and resultantly remains high.On the contrary, in the case of the memory elements MC (00) to MC (11)formed over a semiconductor substrate with an insulating layerinterposed therebetween, during a write operation to the selected memoryelement MC (00), the threshold voltage Vth of the unselected memoryelement MC (11) significantly drops as indicated by the characteristiccurve SO, and resultantly changes from a high level to a low level.

Thus, the threshold voltage Vth of the unselected memory element MC (11)formed over the semiconductor substrate with the insulating layerinterposed therebetween shifts from a high level to a low level whilewrite operation is being performed on the selected memory element MC(00). The high threshold voltage Vth implies that the memory element hasbeen written with data. This means that the unselected memory element MC(11), which is classified as the erroneously-erasable memory elementEPS, has a shortened erroneous erase lifetime in which the unselectedmemory element MC (11) transits from a written state to an erased state.Of course, erasing the written data causes malfunction.

A cause of the threshold voltage Vth drop in the unselected memoryelement MC (11), as shown by the characteristic curve SO in FIG. 11B,has been discovered through the inventors' research as follows. While awrite operation is performed on the selected memory element MC (00), anegative voltage is applied to the unselected word line WL (1) coupledto the unselected memory element MC (11), which is classified as theerroneously-erasable memory element EPS, and a positive voltage isapplied to the unselected bit line BL (1) and unselected source line SL(1), as shown in FIG. 11A. These voltages create a potential differencebetween the unselected word line and the unselected bit line andunselected source line. As a result, holes are generated in the channelof the MONOS transistor MTr of the unselected memory element MC (11). Atthis moment, the P-type semiconductor region where the channel is formedis in an electrically floating state, and therefore the holes generatedin the channel are not collected, but accumulate at the channelinterface. The holes accumulating at the channel interface increase theelectric field strength of the gate oxide film between the chargestorage layer N and channel interface, and the high electric fieldprobably causes discharge of the stored electrons from the nitride filmmaking up the charge storage layer N, or injection of holes into thenitride film, thereby rapidly lowering the threshold voltage. This isprobably the cause why the erroneous erase lifetime of the memoryelement formed over the semiconductor substrate with the insulatinglayer interposed therebetween is shortened in comparison with the memoryelement formed over the semiconductor substrate.

Configuration of Semiconductor Device

FIG. 9 is a block diagram showing the configuration of a semiconductordevice according to the first embodiment. In FIG. 9, LS denotes asemiconductor device. The semiconductor device LS includes, but is notlimited to, a central processing unit CPC, a flash memory FLH, avolatile memory MEM, a peripheral circuit I/O, and a bus BS. The centralprocessing unit CPC, flash memory FLH, volatile memory MEM, andperipheral circuit I/O are respectively composed of transistors formedwith a plurality of semiconductor regions formed above a singlesemiconductor substrate with an insulating layer interposedtherebetween, and other components. In short, a plurality ofsemiconductor regions (SOI layers) are formed over an insulating layerstacked over a semiconductor substrate, and the transistors formed inthe SOI layers and other components make up the aforementioned circuitblocks.

The central processing unit CPC, flash memory FLH, volatile memory MEM,and peripheral circuit I/O are interconnected through the bus BS totransmit and receive data from one another through the bus BS. Forexample, the central processing unit CPC reads out a program stored inthe flash memory FLH through the bus BS, and executes the program. Inthis program execution process, the central processing unit CPC accessesthe volatile memory MEM, flash memory FLH, or/and peripheral circuit I/Othrough the bus BS to perform processing tasks required to execute theprogram.

Configuration of Flash Memory

FIG. 1 is a block diagram showing the configuration of the flash memoryFLH according to the first embodiment. The flash memory FLH according tothe first embodiment includes a memory array 1, a row selection circuit2, a column selection circuit 3, a source line selection circuit 4, aback gate bias circuit 5, a voltage generation circuit 6, and a controlcircuit 7.

The memory array 1 includes memory elements MC (00) to MC (nn), wordlines WL (0) to WL (n), bit lines BL (0) to BL (n), source lines SL (0)to SL (n), and back gate lines BKL. The memory elements MC (00) to MC(nn) are arranged in a matrix over an insulating layer stacked over asemiconductor substrate. The matrix (memory array 1) has rows andcolumns. The word lines WL (0) to WL (n) are arranged along the rows ona one-to-one basis, and the bit lines BL (0) to BL (n) and the sourcelines SL (0) to SL (n) are arranged along the columns, respectively, ona one-to-one basis.

In the matrix, the MONOS transistors MTr of memory elements arranged ina row have the gate electrodes G coupled to a word line arranged alongthe same row, and have the back gates BK coupled to a back gate line BKLarranged along the same row. In addition, the MONOS transistors MTr ofmemory elements arranged in a column in the matrix have the drainregions D coupled to a bit line arranged along the same column, and havethe source regions S are coupled to a source line arranged along thesame column.

For example, the memory elements MC (00) to MC (On) are arranged in the0 th row of the matrix, and the gate electrodes G of the MONOStransistors MTr of the memory elements MC (00) to MC (On) are coupled tothe word line WL (0) arranged along the 0 th row, while the back gatesBK are coupled to a back gate line BKL arranged along the 0 th row. Inaddition, the memory elements MC (00) to MC (n0) are arranged in the 0th column of the matrix, and the drain regions D of the MONOStransistors MTr of the memory elements MC (00) to MC (n0) are coupled tothe bit line BL (0) arranged along the 0 th column, while the sourceregions S are coupled to the source line SL (0) arranged along the 0 thcolumn. This arrangement is applied in the like manner to the 1st to nthrows and the 1st to n th columns.

In FIG. 1, reference letters G, S, D and BK are added to the gateelectrode, source region, drain region, and back gate, respectively, ofonly the memory element MC (00), but the reference letters are omittedfor the other memory elements, as shown in FIG. 10. An exemplarystructure of the memory element will be described later with referenceto FIG. 3.

The row selection circuit 2 includes a row decoder circuit 8 and a wordline bias control circuit 9. The row decoder circuit 8 is coupled to theword lines WL (0) to WL (n) and the word line bias control circuit 9.The row decoder circuit 8 receives a row address signal R-Ad containedin an address signal Add, and decodes the row address signal R-Ad toidentify a word line specified by the row address signal R-Ad from theword lines WL (0) to WL (n). The word line identified is a word linethat is selected (selected word line), while the word line notidentified is a word line that is not selected (unselected word line).

The word line bias control circuit 9 receives word line voltages VWS,VWU and a ground voltage Vs generated by the voltage generation circuit6. The word line voltage VWS is set at a predetermined voltage valuethat is positive with respect to the ground voltage Vs (e.g., +5 V to+10 V), and the word line voltage VWU is set at a predetermined voltagevalue that is negative with respect to the ground voltage Vs (e.g., −5V). Based on the word line voltages VWS, VWU, and the ground voltage Vs,the word line bias control circuit 9 produces a word line selectivevoltage to be applied to the selected word line and a word linenon-selective voltage to be applied to the unselected word lines. Theword line bias control circuit 9 changes the word line selective voltageand word line non-selective voltage to be produced in accordance with aword line control signal CNTW. Although it will be described later, theword line control signal CNTW is created by the control circuit 7 tonotify the word line bias control circuit 9 of a write operation.

The row decoder circuit 8 applies the word line selective voltageproduced by the word line bias control circuit 9 to the selected wordline, and applies the word line non-selective voltage produced by theword line bias control circuit 9 to the unselected word line.

The column selection circuit 3 includes a column decoder circuit 10, abit line bias control circuit 11, and an input/output circuit 12. Thecolumn decoder circuit 10 decodes a column address signal C-Ad containedin the address signal Add to identify a bit line specified by the columnaddress signal C-Ad from the bit lines BL (0) to BL (n). The bit lineidentified is a bit line that is selected (selected bit line), while thebit line not identified is a bit line that is not selected (unselectedbit line).

The bit line bias control circuit 11 receives bit line voltages VBS, VBUand a ground voltage Vs generated by the voltage generation circuit 6.The bit line voltage VBS is set at a predetermined voltage value that isnegative with respect to the ground voltage Vs (e.g., −5 V), and the bitline voltage VBU is set at a predetermined voltage value that ispositive with respect to the ground voltage Vs (e.g., +5 V). Based onthe bit line voltages VBS, VBU, and ground voltage Vs, the bit line biascontrol circuit 11 produces a bit line selective voltage to be appliedto the selected bit line and a bit line non-selective voltage to beapplied to the unselected bit lines. When producing the bit lineselective voltage and bit line non-selective voltage, the bit line biascontrol circuit 11 changes the bit line selective voltage and bit linenon-selective voltage to be produced in accordance with a bit linecontrol signal CNTB. The bit line control signal CNTB is also created bythe control circuit 7, which will be described later, to notify the bitline bias control circuit 11 of a write operation.

The input/output circuit 12 receives a write enable signal WE. If thewrite enable signal WE specifies a write operation, the input/outputcircuit 12 acquires input data DI and supplies the input data DI to thecolumn decoder circuit 10 the column decoder circuit 10 applies avoltage prescribed by the supplied input data DI to the selected bitline. Specifically, if the supplied input data DI gives an instructionto change the state of the selected memory element, the column decodercircuit 10 applies a bit line selective voltage produced by the bit linebias control circuit 11 to the selected bit line, and applies a bit linenon-selective voltage produced by the bit line bias control circuit 11to the unselected bit lines. When the write enable signal WE specifies aread operation, data dO on the selected bit line is conveyed to theinput/output circuit 12 that in turn outputs the data dO as output dataDO.

The source line selection circuit 4 includes a column decoder circuit 13and a source line bias control circuit 14. The column decoder circuit 13decodes a column address signal C-Ad to identify a source line specifiedby the column address signal C-Ad from the source lines SL (0) to SL(n). The source line identified is a source line that is selected(selected source line), while the source line not identified is a sourceline that is not selected (unselected source line).

The source line bias control circuit 14 receives source line voltagesVSS, VSU and a ground voltage Vs generated by the voltage generationcircuit 6. The source line voltage VSS is set at a predetermined voltagevalue that is negative with respect to the ground voltage Vs (e.g., −5V), and the source line voltage VSU is set at a predetermined voltagevalue that is positive with respect to the ground voltage Vs (e.g., +5V). Based on the source line voltages VSS, VSU, and ground voltage Vs,the source line bias control circuit 14 produces a source line selectivevoltage to be applied to the selected source line and a source linenon-selective voltage to be applied to the unselected source lines. Whenproducing the source line selective voltage and source linenon-selective voltage, the source line bias control circuit 14 changesthe source line selective voltage and source line non-selective voltageto be produced in accordance with a source line control signal CNTS. Thesource line control signal CNTS is also created by the control circuit7, which will be described later, to notify the source line bias controlcircuit 14 of a write operation.

The source line selection circuit 4 applies a source line selectivevoltage produced by the source line bias control circuit 14 to theselected source line, and applies a source line non-selective voltageproduced by the source line bias control circuit 14 to the unselectedsource lines.

Although the source line selection circuit 4 shown in FIG. 1 includesthe column decoder circuit 13 as an example, this embodiment is notlimited to this configuration. For example, the column decoder circuit10 included in the column selection circuit 3 can be also used toidentify the source lines.

The back gate bias circuit 5 receives a substrate bias voltage VKS and aground voltage Vs generated by the voltage generation circuit 6, andproduces a back gate voltage to be applied to the back gate lines BKL.The substrate bias voltage VKS is set at a predetermined voltage valuethat is negative with respect to the ground voltage Vs (e.g., −5 V). Theback gate bias circuit 5 is supplied with a back gate control signalCNTK created by the control circuit 7, which will be described later.The back gate bias circuit 5 changes the back gate voltage to beproduced in accordance with the supplied back gate control signal CNTK.The back gate control signal CNTK is also a control signal that notifiesthe back gate bias circuit 5 of a write operation.

The control circuit 7 includes a plurality of circuit blocks forcreating a plurality of control signals; however, FIG. 1 shows onlycircuit blocks necessary for explanation. The control circuit 7 includesa write-verify control circuit 15 and a control signal forming circuit16. A write enable signal WE is supplied to the control signal formingcircuit 16. When the write enable signal WE specifies a write operation,the control signal forming circuit 16 places the aforementioned wordline control signal CNTW, bit line control signal CNTB, source linecontrol signal CNTS, and back gate control signal CNTK into, forexample, a first state. Placing these control signals into the firststate informs the word line bias control circuit 9, bit line biascontrol circuit 11, source line bias control circuit 14, and back gatebias circuit 5 that a write operation has been started.

Upon receiving an end-of-write signal WED supplied from the write-verifycontrol circuit 15, the control signal forming circuit 16 places theaforementioned word line control signal CNTW, bit line control signalCNTB, source line control signal CNTS, and back gate control signal CNTKinto a second state. Placing these control signals into the second stateinforms the word line bias control circuit 9, bit line bias controlcircuit 11, source line bias control circuit 14, and back gate biascircuit 5 that the write operation has been finished.

Write operation performed on the flash memory FLH includes injection ofelectrons into the charge storage layer N of a selected memory element,and verification of the threshold voltage of the selected memoryelement. The electron injection and threshold voltage verification arerepeated until it is verified that the threshold voltage has reached apredetermined value in the threshold voltage verification. Theseoperations appropriately control the amount of charge stored in thecharge storage layer N of the selected memory element. The write-verifycontrol circuit 15 is a circuit that controls the verificationoperation. Specifically, the write-verify control circuit 15 receivesdata dO read out through the selected bit line during a write operation,and verifies whether the threshold voltage of the selected memoryelement reaches a predetermined threshold voltage. When verifying thatthe threshold voltage has reached the predetermined threshold voltage,the write-verify control circuit 15 outputs an end-of-write signal WED.

The voltage generation circuit 6 increases or/and decreases a givenvoltage to produce a voltage that is positive with respect to the groundvoltage Vs and a voltage that is negative with respect to the groundvoltage Vs, and output the voltages, although not limited thereto. FIG.1 clearly shows the voltages to be output, that is, the word linevoltages VWS, VWU, bit line voltages VBS, VBU, source line voltages VSS,VSU, and substrate bias voltage VKS.

Operation of Flash Memory

FIG. 2 is a schematic waveform diagram to describe the operation of theflash memory FLH according to the first embodiment. With reference toFIGS. 1 and 2, the operation of the flash memory FLH will be described.In FIG. 2, the horizontal axis represents time t. In addition, in FIG.2, Add denotes an address signal containing a row address signal R-Adand a column address signal C-Ad, WE denotes a write enable signal,DI/DO denotes input data/output data, and WED denotes an end-of-writesignal. Furthermore, WOP in FIG. 2 indicates periods in which a writeoperation is performed in a schematic form.

Write Operation of Flash Memory

The central processing unit CPC shown in FIG. 9 creates the addresssignal Add, write enable signal WE, and input data DI in FIG. 2, forexample, to execute processing tasks required to perform a program, andsupplies the signals to the flash memory FLH. The output data DO shownin FIG. 2 is, for example, supplied to the central processing unit CPCto be used to execute the processing tasks in accordance with theprogram.

When the address signal Add is turned into an address signal Add1W thatspecifies a given memory element at a time TWS, and the write enablesignal WE changes from a high level to a low level, the flash memory FLHinitiates a write operation. Specifically, the flash memory FLH startswriting input data DI to a memory element specified by the addresssignal Add1W. The row decoder circuit 8 decodes a row address signalR-Ad contained in the address signal Add1W. The row selection circuit 2applies a word line selective voltage to a selected word line specifiedby the row address signal R-Ad, and assumes the other word lines thatare not specified by the row address signal R-Ad as unselected wordlines and applies a word line non-selective voltage to the unselectedword lines.

A column address signal C-Ad contained in the address signal Add1W isdecoded by the column decoder circuits 10 and 13. Through decoding, thecolumn selection circuit 3 and source line selection circuit 4 identify,respectively, a bit line and a source line specified by the columnaddress signal C-Ad. The column selection circuit 3 assumes theidentified bit line as a selected bit line and applies a bit lineselective voltage to the selected bit line, and assumes the other bitlines that are not identified as unselected bit lines and applies a bitline non-selective voltage to the unselected bit lines. The sourceselection circuit 4 assumes the identified source line as a selectedsource line and applies a source line selective voltage to the selectedsource line, and assumes the other source lines that are not identifiedas unselected source lines and applies a source line non-selectivevoltage to the unselected source lines.

The back gate bias circuit 5 applies a back gate voltage to the backgate lines BKL.

The change of the write enable signal WE to a low level informs thecontrol signal forming circuit 16 that a write operation is selected. Inresponse to that, the control signal forming circuit 16 places the wordline control signal CNTW, bit line control signal CNTB, source linecontrol signal CNTS, and back gate control signal CNTK into the firststate corresponding to write operation. Upon receipt of the signals inthe first state, the word line bias control circuit 9, bit line biascontrol circuit 11, source line bias control circuit 14, and back gatebias circuit 5 produce a word line selective voltage and a word linenon-selective voltage, a bit line selective voltage and a bit linenon-selective voltage, a source line selective voltage and a source linenon-selective voltage, and a back gate bias, respectively, suitable forthe write operation, from the time TWS. The voltages produced areapplied to the selected word line, unselected word lines, selected bitline, unselected bit lines, selected source line, unselected sourcelines, and back gate lines as described above.

After the selected memory element is written in accordance with theinput data DI, the write-verify control circuit 15 outputs anend-of-write signal WED (a pulse at a high level in FIG. 2). Thisend-of-write signal WED informs the control signal forming circuit 16that the write operation is finished. When the write operation isfinished, the control signal forming circuit 16 places the word linecontrol signal CNTW, bit line control signal CNTB, source line controlsignal CNTS, and back gate control signal CNTK into the second state.This completes the write operation on the selected memory element at atime TWE.

A further description about the write operation will be given later withreference to FIG. 4 and some other drawings.

Read Operation of Flash Memory

At a time TRS, the address signal Add is turned into an address signalAdd1R. Since the write enable signal WE is at a high level at thismoment, the flash memory FLH initiates a read operation.

Because the write enable signal WE at a high level specifies a readoperation, the control signal forming circuit 16 does not place the wordline control signal CNTW, bit line control signal CNTB, source linecontrol signal CNTS, and back gate control signal CNTK into the firststate corresponding to write operation.

In the same manner as the above-described write operation, a readoperation requires the row decoder circuit 8 to identify a selected wordline and unselected word lines based on the row address signal R-Ad,applies a word line selective voltage to the selected word line, andapplies a word line non-selective voltage to the unselected word lines.Since the word line control signal CNTW is not in the first state atthis moment, the word line bias control circuit 9 produces a word lineselective voltage and word line non-selective voltage that are differentfrom those for the write operation. For example, the word line selectivevoltage is set to a voltage on the gate electrode that turns off whenthe threshold voltage of the selected memory element is high and turnson when the threshold voltage of the selected memory element is low. Inthis example, the word line non-selective voltage is set to a groundvoltage Vs.

In the same manner as the above-described write operation, the columndecoder circuit 13 also identifies a selected source line and unselectedsource lines based on the column address signal C-Ad. The sourceselection circuit 4 applies a source line selective voltage to theidentified selected source line, and applies a source line non-selectivevoltage to the identified unselected source lines. Since the source linebias control circuit 14 is not notified of the write operation by thesource line control signal CNTS, the source line bias control circuit 14produces a source line selective voltage and source line non-selectivevoltage that are different from those used for the write operation. Forexample, the source line bias control circuit 14 produces a groundvoltage Vs for the source line selective voltage and source linenon-selective voltage.

In the same manner as the above-described write operation, the columndecoder circuit 10 also identifies a selected bit line and unselectedbit lines based on the column address signal C-Ad. The column selectioncircuit 3 couples the identified selected bit line to the input/outputcircuit 12, and separates the identified unselected bit lines from theinput/output circuit 12. Since the bit line bias control circuit 11 isnot notified of the write operation by the bit line control signal CNTB,the bit line bias control circuit 11 produces a bit line selectivevoltage and bit line non-selective voltage that are different from thoseused for the write operation. The bit line selective voltage and bitline non-selective voltage produced by the bit line bias control circuit11 are applied to the selected bit line and unselected bit lines,respectively, as a bias voltage. For example, the bit line selectivevoltage is set to a voltage value capable of making a voltage differenceon the selected bit line depending on whether the selected memoryelement is in an on state or an off state. In this example, the bit linenon-selective voltage is not particularly limited to, but is set to aground voltage Vs.

Since the back gate bias circuit 5 is not notified of the writeoperation by the back gate control signal CNTK, the back gate biascircuit 5 produces a back gate voltage that is different from that usedfor the write operation, and applies it to the back gate line BKL. Forexample, the back gate bias circuit 5 continuously applies asemiconductor substrate bias voltage VKS to the back gate lines BKLduring the read operation.

The threshold voltage of the memory element (MONOS transistor) isdetermined by the amount of electrons stored in the charge storage layerN. In read operation, the voltage change on the bit line caused bywhether the selected memory element is in an on state or off state isread out as data stored in the selected memory element. For example, ifthe word line WL (0) and bit line BL (0) are identified as a selectedword line and selected bit line based on the address signal Add1R, aword line selective voltage is applied to the word line WL (0). At thismoment, a ground voltage Vs is applied to the selected source line SL(0), and therefore, the voltage on the selected bit line BL (0) changesin accordance with the threshold voltage of the selected memory elementMC (00). The voltage change on the selected bit line BL (0) is output asread data DO from the input/output circuit 12.

In FIG. 2, after the address signal Add1R is supplied as an addresssignal Add, address signals Add2W and Add3W are supplied to select othermemory elements. Since the write enable signal WE is changed to a lowlevel, the above-described write operation is performed on the selectedmemory elements specified by the address signals Add2W and Add3W.

Structure of Memory Element

A description will be made about memory element structure prior to adetailed description about write operation according to the firstembodiment.

FIGS. 3A to 3C are schematic cross-sectional views showing the structureof a memory element according to the first embodiment. Open circles (◯)and closed circles (●) depicted in FIGS. 3A to 3C will be referred tolater to describe the operation of the erroneously-erasable memoryelement. This section describes only the structure of the memory elementwith reference to FIG. 3A, and omits the explanation about the opencircles and closed circles. Note that FIGS. 3A to 3C are the same exceptfor the open circles and closed circles.

In FIG. 3A, Sub denotes a semiconductor substrate. An insulating layerBOX is formed over a main surface of the semiconductor substrate Sub,and a semiconductor layer SOIL is formed over a main surface of theinsulating layer BOX. The semiconductor layer SOII corresponds to theaforementioned SOI. In the first embodiment, the semiconductor layerSOII is a P-type semiconductor layer. An N-type impurity is introducedin predetermined regions of the P-type semiconductor layer SOII to forma pair of N-type semiconductor regions (second semiconductor regions)SOI2(D) and SOI2(S). The semiconductor region SOI2(D) serves as a drainregion D of a MONOS transistor MTr, while the semiconductor regionSOI2(S) serves as a source region S of the MONOS transistor MTr.

Between the N-type semiconductor regions SOI2(D) and SOI2(S) sandwichedis a semiconductor region (first semiconductor region) SOI1 in which theN-type impurity is not introduced. The semiconductor region SOI1 is asemiconductor region where a channel is formed in the MONOS transistorMTr. A gate oxide film OL1 is formed over a main surface of thesemiconductor region SOI1, and a nitride film NL making up a chargestorage layer N is formed over a main surface of the gate oxide filmOL1. In addition, an oxide film OL2 is formed over a main surface of thenitride film NL, and a conductive layer GL serving as a gate electrode Gis formed over a main surface of the oxide film OL2.

In the first embodiment, the conductive layer GL is an N-typepolysilicon layer (semiconductor layer). Although it is not particularlylimited, the polysilicon layer is etched to shape it into a gateelectrode G, and the polysilicon layer in the shape of the gateelectrode G is used as a mask while an N-type impurity is injected intothe semiconductor layer SOIL Thus, the semiconductor region SOI2(D)corresponding to the drain region D of the MONOS transistor and thesemiconductor region SOI2(S) corresponding to the source region S areformed through self aligning. The N-type impurity is introduced into thepolysilicon layer making up the gate electrode G while the polysiliconlayer is used as a mask, and therefore the gate electrode G is composedof an N-type polysilicon layer.

FIG. 3A represents the semiconductors SOI2(D), SOI2(S) as if they arelocated away from edges of the gate electrode GL for the purpose ofmaking FIG. 3A clear to see; however, the actual semiconductors SOI2(D),SOI2(S) are located closer to the gate electrode GL. In FIG. 3A, BSdenotes protective films.

With reference to FIG. 1, the conductive layer GL serving as a gateelectrode G is coupled to a word line, the semiconductor region SOI2 (D)serving as a drain region D is coupled to a bit line, and thesemiconductor region SOI2 (S) serving as a source region S is coupled toa source line. The semiconductor substrate Sub substantially plays arole of a back gate line BKL. The semiconductor region SOI1 isolatedfrom the semiconductor substrate Sub by the insulating layer BOX is in afloating state. Since the insulating layer BOX is very thin, it ispossible to control the voltage in the semiconductor region SOI1 byapplying a back gate voltage to the semiconductor substrate Sub.

Although FIG. 3A shows the structure of only one of the memory elements,the other memory elements are also formed in a semiconductor layer SOI1formed over the main surface of a single semiconductor substrate Subwith an insulating layer BOX interposed therebetween in the like manneras the memory element shown in FIG. 3A.

When viewing the MONOS transistor MTr, or the memory element, in termsof its structure, the memory element can be assumed to include a P-typesemiconductor region SOI1 formed above a semiconductor substrate Subwith an insulating layer BOX interposed therebetween, a pair of N-typesemiconductor regions SOI2 (D), SOI2 (S) arranged so as to sandwich theP-type semiconductor region SOI1, a nitride film NL arranged above theP-type semiconductor region SOI1 and making up a charge storage layer N,and a conductive layer GL arranged above the charge storage layer N andmaking up a gate electrode G.

Write Operation

FIG. 4 is a waveform diagram showing the waveforms in a write operationperformed on a flash memory FLH according to the first embodiment. FIG.4 shows voltage waveforms on word lines, bit lines, source lines, and aback gate line during a write operation. In FIG. 4, the horizontal axisrepresents time t, and the vertical axis of each waveform representsvoltage. Similar to FIG. 11A, Vs indicated by dashed lines denotesground voltage. In FIG. 4, the voltage above the dashed line representsa voltage value positive with respect to the ground voltage Vs, whilethe voltage below the dashed line represents a voltage value negativewith respect to the ground voltage Vs.

As described above, the write operation on the flash memory FLH includesinjection of electrons into the charge storage layer N of a selectedmemory element and verification of the threshold voltage of the selectedmemory element (write verify operation). In order to make it easier tounderstand the description, FIG. 4 omits waveforms associated with thewrite verify operation. FIG. 4 shows waveforms of the word lines, bitlines, source lines, and back gate line in a period from a time TWS atwhich a write operation starts, to a time TWE at which the writeoperation is finished, as shown in FIG. 2.

FIG. 4 shows waveforms appearing when a write operation is performed onthe memory element MC (00) in FIG. 1. Specifically, the word line WL (0)is a selected word line, the word lines WL (1) to WL (n) are unselectedword lines, the bit line BL (0) is a selected bit line, and the bitlines BL (1) to BL (n) are unselected bit lines. Additionally, thesource line SL (0) is a selected source line, and the source lines SL(1) to SL (n) are unselected source lines. During the write operation,the waveforms of the unselected word lines WL (1) to WL (n) behave thesame way, the waveforms of the unselected bit lines BL (1) to BL (n)behave the same way, and the waveforms of the unselected source lines SL(1) to SL (n) behave the same way. Because the waveforms of all theunselected lines behave the same way, FIG. 4 shows only the waveforms ofthe unselected word line WL (1), unselected bit line BL (1), andunselected source line SL (1) as representatives.

The voltages on the selected word line WL (0) and unselected word lineWL (1) are determined by the word line selective voltage and word linenon-selective voltage to be applied to the respective word lines fromthe row selection circuit 2, and the voltages on the selected word lineWL (0) and unselected word line WL (1) can be therefore regarded as theword line selective voltage and word line non-selective voltage outputfrom the row selection circuit 2. Similarly, the voltages on theselected bit line BL (0) and unselected bit line BL (1) can be regardedas the bit line selective voltage and bit line non-selective voltageoutput from the column selection circuit 3. In addition, the voltage onthe selected source line SL (0) and unselected source line SL (1) can beregarded as the source line selective voltage and source linenon-selective voltage output from the source line selection circuit 4.Furthermore, the voltage on the back gate line BKL can be regarded asthe back gate voltage output from the back gate bias circuit 5.

In the first embodiment, when notified of a write operation by a wordline control signal CNTW, the word line bias control circuit 9 (FIG. 1)produces a word line selective voltage whose value periodically changesand a word line non-selective voltage whose value periodically changes.Specifically, the word line bias control circuit 9 produces a word lineselective voltage (voltage on the selected word line WL (0)) that is apositive voltage in periods T1, T3, T5, T7, T9, and changes to a groundvoltage Vs in periods T2, T4, T6, T8, T10, as shown in FIG. 4. In otherwords, the word line selective voltage alternately changes between thepositive voltage and ground voltage Vs. In this case, the word line biascontrol circuit 9 uses the applied word line voltage VWS as the positivevoltage. The word line bias control circuit 9 produces the word lineselective voltage by, for example, alternately switching between theword line voltage VWS and ground voltage Vs.

The word line bias control circuit 9 produces a word line non-selectivevoltage (voltage on the unselected word line WL (1)) that is a negativevoltage in the periods T1, T3, T5, T7, T9, and changes to a groundvoltage Vs in the periods T2, T4, T6, T8, T10 as shown in FIG. 4. Inother words, the word line non-selective voltage alternately changesbetween the negative voltage and ground voltage Vs. In this case, theword line bias control circuit 9 uses the applied word line voltage VWUas the negative voltage. The word line bias control circuit 9 producesthe word line non-selective voltage by alternately switching between theword line voltage VWU and ground voltage Vs.

In each of the periods T1, T3, T5, T7, T9, the word line selectivevoltage has a positive value, while the word line non-selective voltagehas a negative value. In each of the periods T2, T4, T6, T8, T10, boththe word line selective voltage and word line non-selective voltage arethe ground voltage Vs.

When notified of the write operation by a bit line control signal CNTB,the bit line bias control circuit 11 (FIG. 1) produces a bit lineselective voltage whose value periodically changes and a bit linenon-selective voltage whose value periodically changes as the word linebias control circuit 9 does. Specifically, the bit line bias controlcircuit 11 produces a bit line selective voltage (voltage on theselected bit line BL(0)) that is a negative voltage in the periods T1,T3, T5, T7, T9, and changes to a ground voltage Vs in the periods T2,T4, T6, T8, T10, as shown in FIG. 4. In other words, the bit lineselective voltage alternately changes between the negative voltage andground voltage Vs. In this case, the bit line bias control circuit 11uses the applied bit line voltage VBS as the negative voltage. The bitline bias control circuit 11 produces the bit line selective voltage by,for example, alternately switching between the bit line voltage VBS andground voltage Vs.

In addition, the bit line bias control circuit 11 produces a bit linenon-selective voltage (voltage on the unselected bit line BL (1)) thatis a positive voltage in the periods T1, T3, T5, T7, T9, and changes tothe ground voltage Vs in the periods T2, T4, T6, T8, T10 as shown inFIG. 4. In other words, the bit line non-selective voltage alternatelychanges between the positive voltage and ground voltage Vs. In thiscase, the bit line bias control circuit 11 uses the applied bit linevoltage VBU as the positive voltage. The bit line bias control circuit11 produces the bit line non-selective voltage by alternately switchingbetween the bit line voltage VBU and ground voltage Vs.

In each of the periods T1, T3, T5, T7, T9, the bit line selectivevoltage has a negative value, while the bit line non-selective voltagehas a positive value. In each of the periods T2, T4, T6, T8, T10, boththe bit line selective voltage and bit line non-selective voltage arethe ground voltage Vs.

When notified of the write operation by a source line control signalCNTS, the source line bias control circuit 14 (FIG. 1) produces a sourceline selective voltage whose value periodically changes and a sourceline non-selective voltage whose value periodically changes as the bitline bias control circuit 11 does. Specifically, the source line biascontrol circuit 14 produces a source line selective voltage (voltage onthe selected source line SL (0)) that is a negative voltage in theperiods T1, T3, T5, T7, T9, and changes to a ground voltage Vs in theperiods T2, T4, T6, T8, T10, as shown in FIG. 4. In other words, thesource line selective voltage alternately changes between the negativevoltage and ground voltage Vs. In this case, the source line biascontrol circuit 14 uses the applied source line voltage VSS as thenegative voltage. The source line bias control circuit 14 produces thesource line selective voltage by, for example, alternately switchingbetween the source line voltage VSS and ground voltage Vs.

In addition, the source line bias control circuit 14 produces a sourceline non-selective voltage (voltage on the unselected source line SL(1)) that is a positive voltage in the periods T1, T3, T5, T7, T9, andchanges to the ground voltage Vs in the periods T2, T4, T6, T8, T10, asshown in FIG. 4. In other words, the source line non-selective voltagealternately changes between the positive voltage and ground voltage Vs.In this case, the source line bias control circuit 14 uses the appliedsource line voltage VSU as the positive voltage. The source line biascontrol circuit 14 produces the source line non-selective voltage by,for example, alternately switching between the source line voltage VSUand ground voltage Vs.

In each of the periods T1, T3, T5, T7, T9, the source line selectivevoltage has a negative value, while the source line non-selectivevoltage has a positive value. In each of the periods T2, T4, T6, T8,T10, both the source line selective voltage and source linenon-selective voltage are the ground voltage Vs.

When notified of the write operation by a back gate control signal CNTK,the back gate bias circuit 5 periodically changes the back gate voltage(voltage on the back gate line BKL) as shown in FIG. 4. Specifically,the back gate bias circuit 5 produces a back gate voltage that is anegative voltage in the periods T1, T3, T5, T7, T9, and changes to theground voltage Vs in the periods T2, T4, T6, T8, T10. For example, theback gate bias circuit 5 produces the back gate voltage by alternatelyswitching between the applied substrate bias voltage VKS and groundvoltage Vs.

In the first embodiment, the voltages on the selected bit line BL (0),selected source line SL (0), unselected word line WL (1), unselected bitline BL (1), unselected source line SL (1), and back gate line BKLbehave all the same way as those in FIG. 11 in the periods T1, T3, T5,T7, T9 when the voltage on the selected word line WL (0) is a positivevoltage, more specifically, when the word line selective voltage is apositive voltage. This implies that electrons are injected into thecharge storage layer N of the selected memory element MC (00) in each ofthe periods T1, T3, T5, T7, T9, to write the selected memory element MC(00). In these periods, as described above, holes accumulate in thechannel of the MONOS transistor MTr of the unselected memory elements MC(11) to MC (nn) that are classified as erroneously-erasable memoryelements EPS (FIG. 10) among the unselected memory elements.

FIGS. 5A and 5B are characteristic diagrams showing the variations ofthe electric field and charge of an unselected memory element accordingto the first embodiment. Specifically, FIG. 5A shows the variations ofthe electric field of a gate oxide film of an unselected memory element,which is classified as the erroneously-erasable memory element EPS, andFIG. 5B shows the variations of charge in the channel. This sectiondescribes the memory element MC (11) as an example of the unselectedmemory element classified as the erroneously-erasable memory elementEPS; however, the other unselected memory elements classified as theerroneously-erasable memory elements EPS have the same characteristics.

In FIGS. 5A and 5B, the horizontal axis represents time. Periods T1 toT10 shown in FIGS. 5A and 5B are equivalent to the periods T1 to T10shown in FIG. 4. For example, the periods T1 and T2 in FIGS. 5A and 5Bcorrespond to the periods T1 and T2 in FIG. 4, respectively.Accordingly, in each of the periods T1, T3, T5, T7, T9 shown in FIGS. 5Aand 5B, electrons, which serves as charge, are injected into the chargestorage layer N of the selected memory element MC (00), and are storedin the layer.

In FIG. 5A, the vertical axis indicates the electric field of the gateoxide film of the MONOS transistor MTr of the unselected memory elementMC (11). FIG. 5A shows a curve Bch indicated by a dashed line. The curveBch is a characteristic curve representing the variations in electricfield when, as shown in FIG. 11A, a negative word line non-selectivevoltage is continuously applied to the unselected word line WL (1), anda positive bit line non-selective voltage and a positive source linenon-selective voltage are continuously applied to the unselected bitline BL (1) and unselected source line SL (1), respectively. At thismoment, a negative voltage is continuously applied to the back gate lineBKL, too.

FIG. 5A also shows a curve Sch indicated by a solid line. The curve Schis a characteristic curve representing the variations in electric fieldwhen, as shown in FIG. 4, the word line non-selective voltage applied tothe unselected word line WL (1) is periodically changed, and the bitline non-selective voltage and source line non-selective voltage appliedto the unselected bit line BL (1) and unselected source line SL (1) arealso periodically changed. At this moment, the back gate voltage appliedto the back gate line BKL is periodically changed, too.

The vertical axis in FIG. 5B represents the charge density (carrierdensity) in the channel of the MONOS transistor MTr of the unselectedmemory element MC (11). In FIG. 5B, the curve Sche is a characteristiccurve representing the variations in hole density out of the chargedensity in the channel. In FIG. 5B, the curve Scee is a characteristiccurve representing the variations in electron density out of the chargedensity in the channel.

As shown by the characteristic curve Sche in FIG. 5B, holes are injectedinto the channel of the unselected memory element MC (11) in each of theperiods T1, T3, T5, T7, T9 in which electrons are injected into thecharge storage layer N of the selected memory element MC (00), and theholes start accumulating gradually at the channel interface. On thecontrary, as shown by the characteristic curve Scee in FIG. 5B,electrons are injected into the channel of the unselected memory elementMC (11) in each of the periods T2, T4, T6, T8, T10 in which electronsare not injected into the charge storage layer N of the selected memoryelement MC (00).

In the periods T2, T4, T6, T8, T10, the word line non-selective voltageapplied to the unselected word line WL (1), the bit line non-selectivevoltage applied to the unselected bit line BL (1), the source linenon-selective voltage applied to the unselected source line SL (1), andthe back gate voltage applied to the back gate line BKL are all set tothe same ground voltage Vs. As described with reference to FIG. 3, inthe first embodiment, an N-type polysilicon layer is used as aconductive layer GL that makes up a gate electrode G, and a P-typesemiconductor region is used as a semiconductor region SOI1 where thechannel is formed. This configuration creates a difference in workfunction between the conductive layer GL making up the gate electrode Gand the semiconductor region SOI1. The work function differencesubstantially creates a potential difference between the gate electrodeG and channel even if the same ground voltages Vs are applied to thegate electrode G (unselected word line) and the drain region D(unselected bit line) and source region S (unselected source line), andresultantly electrons are injected into the channel from the drainregion D and source region S.

The holes injected into the channel in the periods T1, T3, T5, T7, T9recombine with the injected electrons in the subsequent periods T2, T4,T6, T8, T10, and therefore the holes accumulated in the channeldecrease, and the electric field is thereby lowered as shown by thecharacteristic curve Sch in FIG. 5A. This can prevent the unselectedmemory element MC (11), which is classified as the erroneously-erasablememory element EPS, from changing its threshold voltage. Thus, thepossibility of erroneously erasing the unselected memory element, whichis classified as the erroneously-erasable memory element EPS, can bereduced.

The following describes the operation in the unselected memory elementMC (11) in a diagrammatic way with reference to FIGS. 3A to 3C. In FIGS.3A to 3C, open circles (∘) diagrammatically represent holes, part ofwhich is indicated by a reference letter he. In FIGS. 3A to 3C, closedcircles (●) diagrammatically represent electrons, part of which isindicated by a reference letter ee. FIG. 3A shows the unselected memoryelement MC (11) in a period T1, and FIGS. 3B and 3C show the unselectedmemory element MC (11) in a period T2 following the period T1.

In FIG. 3A, a negative word line non-selective voltage is applied to thegate electrode G through the unselected word line WL (1), and a positivebit line non-selective voltage and a positive source line non-selectivevoltage are applied to the drain region D and source region S throughthe unselected bit line BL (1) and unselected source line SL (1),respectively. At this moment, a negative back gate voltage is applied tothe semiconductor substrate Sub. Through the voltage application, holeshe are injected into the channel of the MONOS transistor MTr, andaccumulate at the channel interface.

When the period T2 arrives, the word line non-selective voltage appliedto the gate electrode G changes from the negative voltage to the groundvoltage Vs, and the bit line non-selective voltage and source linenon-selective voltage applied to the drain region D and source region Schange from the positive voltage to the ground voltage Vs. Through thevoltage application, electrons ee are injected into the channel of theMONOS transistor MTr from the drain region D and source region S. Theinjected electrons ee recombine with the holes he. As a result, as shownin FIG. 3C, the holes he accumulated at the interface of the MONOStransistor MTr disappear or decrease before the transition from theperiods T2 to the period T3.

As shown in FIG. 5B, the hole density in the channel of the MONOStransistor MTr becomes high in the periods T1, T3, T5, T7, T9 asindicated by the characteristic curve Sche, but the electron density inthe channel becomes high in the following periods T2, T4, T6, T8, T10 asindicated by the characteristic curve Scee, and recombination of theholes and electrons occurs in the periods T2, T4, T6, T8, T10, and theholes thereby decrease.

As shown in FIG. 11A, if there is a potential difference between theword line non-selective voltage and the bit line non-selective voltageand source line non-selective voltage, holes are stored in the channel.The holes stored at the channel interface of the unselected memoryelement MC (11) with electrons stored in the charge storage layer N makethe electric field of, for example, the insulating film (e.g., OL1 inFIG. 3) stronger as indicated by the characteristic curve Bch in FIG.5A. The strong electric field causes ejection of the electrons stored inthe charge storage layer N or injection of the holes into the chargestorage layer N. On the contrary, in the first embodiment, the holesinjected and stored in the channel in the periods T1, T3, T5, T7, T9 canbe reduced by injecting electrons into the channel in the periods T2,T4, T6, T8, T10. Consequently, for example, the electric field of theinsulating film can be prevented from being strong, and therefore theamount of the electrons in the charge storage layer N to be ejected orthe amount of holes to be injected to the charge storage layer N can bereduced. Thus, the erroneous erase lifetime until which the unselectedmemory element, which is classified as the erroneously-erasable memoryelement EPS, in a write state changes its state can be prevented frombeing shortened.

Second Embodiment

FIG. 6 is a waveform diagram showing waveforms in a write operationperformed on a flash memory FLH according to the second embodiment. Inthe waveform diagram in FIG. 6, the memory element MC (00) in FIG. 1 isa selected memory element, and the memory element MC (11) is anunselected memory element classified as the erroneously-erasable memoryelement as described in the first embodiment.

As described with reference to FIG. 4, the voltage on the selected wordline WL (0) is regarded as a word line selective voltage, and thevoltage on the unselected word line WL (1) is regarded as a word linenon-selective voltage. In addition, the voltage on the selected bit lineBL (0) is regarded as a bit line selective voltage, and the voltage onthe unselected bit line BL (1) is regarded as a bit line non-selectivevoltage. Furthermore, the voltage on the selected source line SL (0) isregarded as a source line selective voltage, and the voltage on theunselected source line SL (1) is regarded as a source line non-selectivevoltage. In order to make it easier to understand the description, FIG.6 also omits waveforms associated with a write verify operation.

First, differences between the voltage waveforms in FIG. 6 and thevoltage waveforms in FIG. 11A will be described. One of the differencesfrom FIG. 11A is that the bit line non-selective voltage and source linenon-selective voltage applied to the unselected bit line BL (1) andunselected source line SL (1), respectively, periodically change.Specifically, the bit line non-selective voltage and source linenon-selective voltage independently alternates periodically betweenpositive and negative with respect to the ground voltage Vs. The bitline non-selective voltage and source line non-selective voltage arepositive in the periods T1, T3, T5, T7, T9 as with the case of FIG. 11A.On the other hand, the bit line non-selective voltage and source linenon-selective voltage are negative in the periods T2, T4, T6, T8, T10 asthe word line non-selective voltage is.

Thus, the voltages on the unselected bit line BL (1) and unselectedsource line SL 1) are positive in the periods T1, T3, T5, T7, T9 as withthe case of FIG. 11A. On the other hand, the voltages on the unselectedbit line BL (1) and unselected source line SL (1) are negative in theperiods T2, T4, T6, T8, T10 as the voltage on the unselected word lineWL (1) is.

The voltage on the unselected word line WL (1) is kept negative throughthe periods T1 to T10, while the voltages on the unselected bit line BL(1) and unselected source line SL (1) are positive in the periods T1,T3, T5, T7, T9. Therefore, as described with reference to FIG. 11A,holes are injected into the channel of the MONOS transistor MTr of theunselected memory element MC (11) classified as the erroneously-erasablememory element EPS in the periods T1, T3, T5, T7, T9. On the other hand,the voltages on the unselected bit line BL (1) and unselected sourceline SL (1) are negative in the periods T2, T4, T6, T8, T10 as thevoltage on the unselected word line is. Because these voltages arenegative, the potential difference between the unselected word line WL(1) and the unselected bit line BL (1) and unselected source line SL (1)becomes small in the periods T2, T4, T6, T8, T10. For example, thevoltages on the unselected word line WL (1), unselected bit line BL (1),and unselected source line SL (1) become all the same. In these periodswhere the potential difference is small, electrons are injected into thechannel of the MONOS transistor MTr of the unselected memory element MC(11) as described in the first embodiment. Consequently, as with thecase of the first embodiment, the erroneous erase lifetime can beprevented from being shortened. In addition, in the second embodiment, apositive voltage is continuously applied as a word line selectivevoltage to the selected word line WL (0) coupled to the selected memoryelement MC (00) through all the periods T1 to T10, while a negative bitline selective voltage and a negative source line selective voltage arecontinuously applied to the selected bit line BL (0) and selected sourceline SL (0), respectively, through all the periods, thereby shorteningthe time required to write the selected memory element.

Third Embodiment

FIG. 7 is a waveform diagram showing waveforms in a write operationperformed on a flash memory FLH according to the third embodiment. Inthe waveform diagram in FIG. 7, the memory element MC (00) shown in FIG.1 is a selected memory element, and the memory element MC (11) is anunselected memory element classified as the erroneously-erasable memoryelement EPS, as described in the first and second embodiments.

As described with reference to FIGS. 4 and 6, the voltage on theselected word line WL (0) is regarded as a word line selective voltage,and the voltage on the unselected word line WL (1) is regarded as a wordline non-selective voltage. In addition, the voltage on the selected bitline BL (0) is regarded as a bit line selective voltage, and the voltageon the unselected bit line BL (1) is regarded as a bit linenon-selective voltage. Furthermore, the voltage on the selected sourceline SL (0) is regarded as a source line selective voltage, and thevoltage on the unselected source line SL (1) is regarded as a sourceline non-selective voltage. In order to make it easier to understand thedescription, FIG. 7 also omits waveforms associated with a write verifyoperation.

First, differences between the voltage waveforms in FIG. 7 and thevoltage waveforms in FIG. 11A will be described. One of the differencesfrom FIG. 11A is that the bit line non-selective voltage applied to theunselected bit line BL (1) periodically changes. Specifically, the bitline non-selective voltage periodically alternates between positive andnegative with respect to the ground voltage Vs. The bit linenon-selective voltage is positive in the periods T1, T3, T5, T7, T9 aswith the case of FIG. 11A. On the other hand, the bit line non-selectivevoltage is negative in the periods T2, T4, T6, T8, T10 as the word linenon-selective voltage is.

Thus, the voltages on the unselected bit line BL (1) and unselectedsource line SL (1) are positive in the periods T1, T3, T5, T7, T9 aswith the case of FIG. 11A. On the other hand, the voltage on theunselected bit line BL (1) is negative in the periods T2, T4, T6, T8,T10 as the voltage on the unselected word line WL (1) is.

The voltage on the unselected word line WL (1) is negative in theperiods T1, T3, T5, T7, T9, while the voltages on the unselected bitline BL (1) and unselected source line SL (1) are positive in theperiods T1, T3, T5, T7, T9. Therefore, as described with reference toFIG. 11A, holes are injected into the channel of the MONOS transistorMTr of the unselected memory element MC (11) classified as theerroneously-erasable memory element EPS. On the other hand, the voltageon the unselected bit line BL (1) is negative in the periods T2, T4, T6,T8, T10 as the voltage on the unselected word line WL (1) is. Becausethe voltage is negative, the potential difference between the unselectedword line WL (1) and the unselected bit line BL (1) becomes small in theperiods T2, T4, T6, T8, T10. For example, the voltages on the unselectedword line WL (1) and the unselected bit line BL (1) become the same. Inthese periods where the potential difference is small, electrons areinjected into the channel of the MONOS transistor MTr of the unselectedmemory element MC (11) from the drain region D coupled to the unselectedbit line, as described in the first embodiment. Consequently, as withthe case of the first embodiment, the erroneous erase lifetime can beprevented from being shortened.

In addition, in the third embodiment, a positive voltage is continuouslyapplied as a word line selective voltage to the selected word line WL(0) coupled to the selected memory element MC (00) through all theperiods T1 to T10, and a negative bit line selective voltage and anegative source line selective voltage are continuously applied to theselected bit line BL (0) and selected source line SL (0), respectively,through all the periods, thereby shortening the time required to writethe selected memory element.

In the first and second embodiments, a negative voltage is applied toboth the unselected bit line BL (1) and unselected source line SL (1) inthe periods T2, T4, T6, T8, T10. On the other hand, in the thirdembodiment, a negative voltage is applied as a bit line non-selectivevoltage to the unselected bit line BL (1), and a positive voltage isapplied as a source line non-selective voltage to the unselected sourceline BL (1), in the periods T2, T4, T6, T8, T10. When focusing on theunselected memory element MC (11) classified as the erroneously-erasablememory element EPS, a negative voltage is applied to the drain region Dof the MONOS transistor MTr making up the unselected memory element MC(11), and a positive voltage is applied to the source region S, forexample, in the period T2. This creates a potential difference betweenthe drain region D and source region S. The potential difference causesa drift field that allows electrons to be supplied from the drain regionD to the channel interface in a shorter period of time. This phenomenonoccurs in the periods T4, T6, T8, and T10 in addition to the period T2described as an example.

Modification

FIG. 7 shows an example in which the bit line non-selective voltageapplied to the unselected bit line BL (1) is periodically changed;however, in this modification, the source line non-selective voltageapplied to the unselected source line SL (1) periodically changes.Specifically, the source line non-selective voltage periodicallyalternates between positive and negative with respect to the groundvoltage Vs during a write operation. In this modification, the sourceline non-selective voltage is positive in the periods T1, T3, T5, T7,T9, while the source line non-selective voltage is negative in theperiods T2, T4, T6, T8, T10. The bit line non-selective voltage appliedto the unselected bit line BL (1) is continuously kept positive throughthe periods T1 to T10.

Through the voltage application, a positive non-selective voltage isapplied to the unselected bit line BL (1) during the write operation,and therefore the voltage on the unselected bit line BL (1) is positive.On the other hand, a positive source line non-selective voltage isapplied to the unselected source line SL (1) in the periods T1, T3, T5,T7, T9, and therefore the voltage on the unselected source line SL (1)is positive. In addition, a negative source line non-selective voltageis applied to the unselected source line SL (1) in the periods T2, T4,T6, T8, T10, and therefore the voltage on the unselected source line SL(1) is negative. Consequently, the potential difference between theunselected word line WL (1) and unselected source line SL (1) becomessmall in the periods T2, T4, T6, T8, T10, and electrons are injectedinto the channel of the unselected memory element MC (11) as describedin the first embodiment. In this case, the electrons are injected fromthe source region S coupled to the unselected source line SL (1) intothe channel. Thus, the erroneous erase lifetime of the unselected memoryelement, which is classified as the erroneously-erasable memory elementEPS, can be prevented from being shortened.

Also in this modification, a negative word line selective voltage,positive bit line selective voltage, and positive source line selectivevoltage are continuously applied to the selected memory element MC (00)during the write operation in the same manner as shown in FIG. 11A,thereby shortening the time required to write the selected memoryelement.

Furthermore, a negative voltage is applied to the source region S of theunselected memory element classified as the erroneously-erasable memoryelement EPS and a positive voltage is applied to the drain region D inthe periods T2, T4, T6, T8, T10. The voltage application creates apotential difference between the source region S and drain region D. Thepotential difference causes a drift field that allows electrons to besupplied from the source region S to the channel interface in a shorterperiod of time.

Fourth Embodiment

FIG. 8 is a waveform diagram showing waveforms in a write operationperformed on a flash memory FLH according to the fourth embodiment. FIG.8 shows voltage waveforms of the selected word line WL (0), unselectedword line WL (1), selected bit line BL(0), unselected bit line BL (1),selected source line SL (0), unselected source line SL (1), and backgate line BKL as shown in FIG. 4. A word line selective voltage and wordline non-selective voltage produced by the word line bias controlcircuit 9 shown in FIG. 1 are applied to the selected word line WL (0)and unselected word line WL (1), respectively. A bit line selectivevoltage and bit line non-selective voltage produced by the bit line biascontrol circuit 11 shown in FIG. 1 are applied to the selected bit lineBL (0) and unselected bit line BL (1), respectively. A source lineselective voltage and source line non-selective voltage produced by thesource line bias control circuit 14 shown in FIG. 1 are applied to theselected source line SL (0) and unselected source line SL (1),respectively. In addition, a back gate voltage produced by a back gatebias circuit 5 shown in FIG. 1 is applied to the back gate line BKL.

Accordingly, it can be assumed that FIG. 8 shows waveforms of a wordline selective voltage, word line non-selective voltage, bit lineselective voltage, bit line non-selective voltage, source line selectivevoltage, source line non-selective voltage, and back gate voltage, asshown in FIG. 4. In order to make it easier to understand thedescription, FIG. 8 also omits waveforms associated with a write verifyoperation.

Differences between the waveforms in FIG. 4 and the waveforms accordingto the fourth embodiment (FIG. 8) will be described. In the firstembodiment, the word line selective voltage, word line non-selectivevoltage, bit line selective voltage, bit line non-selective voltage,source line selective voltage, source line non-selective voltage, andback gate voltage periodically change in a period in which a writeoperation is performed (period from time TWS to TWE in FIG. 2). On theother hand, in the fourth embodiment, only the word line non-selectivevoltage periodically alternates between positive and negative. Inaddition, in the fourth embodiment, the word line selective voltage iskept positive, and the bit line selective voltage, source line selectivevoltage, and back gate voltage are kept negative during the writeoperation. Also, the bit line non-selective voltage and source linenon-selective voltage are kept positive in the write operation. Inshort, except for the word line non-selective voltage, the word lineselective voltage, bit line selective voltage, bit line non-selectivevoltage, source line selective voltage, source line non-selectivevoltage, and back gate voltage exhibit the similar waveforms as thoseshown in FIG. 11A.

As described above, in the fourth embodiment, electrons are injectedinto the charge storage layer N of the selected memory element MC (00)through all the periods T1 to T10 as described with reference to FIG.11A.

On the other hand, the word line non-selective voltage applied to theunselected word line WL (1) changes to negative with respect to theground voltage Vs in the periods T1, T3, T5, T7, T9, while changing topositive with respect to the ground voltage Vs in the periods T2, T4,T6, T8, T10. In short, the word line non-selective voltage periodicallyalternates between negative and positive. Accordingly, the voltage onthe unselected word line WL (1) periodically changes during the writeoperation as shown in FIG. 8. On the other hand, the voltages on theselected word line WL (0), unselected bit line BL (1), and unselectedsource line SL (1) are kept positive as shown in FIG. 8. In addition,the voltages on the selected bit line BL (0), selected source line SL(0), and back gate line BKL are kept negative as shown in FIG. 8.

Since the word line non-selective voltage changes to negative in theperiods T1, T3, T5, T7, T9, the voltages on the unselected word line WL(1), unselected bit line BL (1), unselected source line SL (1), and backgate line BKL become the same as the voltages shown in FIG. 11A.Accordingly, holes are injected into the channel of the MONOS transistorMTr making up the memory element MC (11) in the periods T1, T3, T5, T7,T9.

On the other hand, the word line non-selective voltage changes topositive in the periods T2, T4, T6, T8, T10, and therefore the potentialdifference between the voltages on the unselected bit line BL (1) andunselected source line SL (1) and the voltage on the unselected wordline WL (1) becomes small. For example, the voltages on the unselectedword line WL (1), unselected bit line BL (1), and unselected source lineSL (1) become all the same. Accordingly, as described in the firstembodiment, electrons are injected into the channel of the MONOStransistor MTr of the unselected memory element MC (11) classified asthe erroneously-erasable memory element EPS, and the electrons recombinewith the holes accumulated in the channel of the unselected memoryelement MC (11), thereby preventing the erroneous erase lifetime frombeing shortened.

In the fourth embodiment, electrons are injected into the charge storagelayer N of the MONOS transistor MTr of the selected memory element MC(00) through all the periods T1 to T10. This can shorten the timerequired to write the selected memory element.

In the second embodiment, for example, a negative bit line non-selectivevoltage and a negative source line non-selective voltage are applied tothe unselected bit line BL (1) and unselected source line SL (1),respectively, in the periods T2, T4, T6, T8, T10. In the same periodsT2, T4, T6, T8, T10, a positive word line selective voltage is appliedto the selected word line WL (0) in the second embodiment. The positiveword line selective voltage may bring the unselected memory elementcoupled to the selected word line, unselected bit line, and unselectedsource line, or more specifically, the unselected memory element (e.g.,MC (01)) classified as the write-protected memory element WIS describedwith reference to FIG. 10, into the same state as the selected memoryelement in the periods T2, T4, T6, T8, T10, and the unselected memoryelement may be weakly written and possibly lose the stored data.

However, in the fourth embodiment, a positive bit line non-selectivevoltage and a positive source line non-selective voltage are applied tothe unselected bit line BL (1) and unselected source line SL (1),respectively, in each of the periods T2, T4, T6, T8, T10, thereby beingable to prevent the unselected memory element classified as thewrite-protected memory element WIS from being weakly written in theperiods T2, T4, T6, T8, T10.

Although the first to fourth embodiments have been described using theword lines WL (0), WL (1), bit lines BL (0), BL (1), and source lines SL(0), SL (1) as examples, the other word lines, bit lines, and sourcelines will be treated in the same way.

Although the write operation is designed to be achieved at a highthreshold voltage in the first to fourth embodiments, the writeoperation can be achieved at a low threshold voltage. In this case,injection and accumulation of electrons in the charge storage layer ofthe MONOS transistor will be implemented in erase operation. If a memoryelement is selected from memory elements arranged in a matrix in eraseoperation, some unselected memory elements are classified aserroneously-erasable memory elements EPS in the same manner as the writeoperation described in the first to fourth embodiments. Even if thewrite operation is designed to be achieved at a low threshold voltage,the unselected memory elements classified as the erroneously-erasablememory elements EPS can be prevented from changing their states in theerase operation.

The erase operation also includes an erase verify operation to verifywhether the threshold voltage of a selected memory element has reached apredetermined value. In the erase verify operation, the time at whichthe threshold voltage of the selected memory element is verified to havereached the predetermined value can be used as the time at which theaforementioned end-of-write signal WED is output.

Although the first to fourth embodiments have been described using theN-channel MONOS transistor as an example, these embodiments can beimplemented using a P-channel MONOS transistor. When using the P-channelMONOS transistor, the semiconductor region SOI1 where a channel isformed in FIG. 3 is an N-type semiconductor region, and the drain regionSOI2 (D) and source region SOI2 (S) are P-type semiconductor regions. Inaddition, the gate electrode G is made of, for example, a P-typepolysilicon layer.

When a write operation is performed on a MONOS transistor, the thresholdvoltage is changed by injecting majority charge carriers of the drainregion D and source region S into the charge storage layer N and storingthe majority charge carriers in the charge storage layer N. As describedin the first to fourth embodiments, since the drain region D and sourceregion S of the N-channel MONOS transistor are N-type (firstconductivity type) semiconductor regions, the majority charge carriersof the drain region D and source region S are electrons, and thereforeelectrons are stored in the charge storage layer N. On the other hand,since the drain region D and source region S of the P-channel MONOStransistor are P-type (second conductivity type) semiconductor regions,the majority charge carriers of the drain region D and source region Sare holes.

In the first to fourth embodiments, when a write operation is performedon a MONOS transistor MTr making up a selected memory element (e.g., MC(00)), holes are injected into the channel of the MONOS transistor MTrmaking up an unselected memory element (e.g., MC (11)) classified as anerroneously-erasable memory element EPS as shown in FIG. 3A. The holesare the majority charge carriers of the P-type (second conductivitytype) semiconductor region whose conductivity type is different fromthat of the N-type (first conductivity type) semiconductor regionsforming the drain region D and source region S.

During the write operation performed on the selected memory element MC(00), the majority charge carriers (holes) of a conductivity type(second conductivity type), which is different from the conductivitytype (first conductivity type) of the drain region D and source regionS, are injected into the channel of the MONOS transistor making up theunselected memory element MC (11) classified as an erroneously-erasablememory element EPS. In the first to fourth embodiments, the majoritycharge carriers (electrons) of the conductivity type (first conductivitytype) of the drain region D and source region S are injected into thechannel of the unselected memory element MC (11) classified as theerroneously-erasable memory element EPS during the write operation onthe selected memory element. This causes the charge (holes) accumulatedat the channel interface of the MONOS transistor making up theunselected memory element MC (11) to recombine with the injected charge(electrons), thereby being able to prevent the unselected memory elementMC (11) from changing its state.

The flash memory FLH can be erased as well as written and read. In thefirst to fourth embodiments described using an N-channel MONOStransistor as an example of a MONOS transistor of the memory element,the write operation is implemented by injecting and storing electrons inthe charge storage layer of the MONOS transistor. According to thedescription, performing the write operation brings the threshold voltageof the MONOS transistor to a high level. On the contrary, the eraseoperation involves injection of holes into the charge storage layer ofthe MONOS transistor, and brings the threshold voltage to a low level.

This erase operation is initiated by, for example, specifying an eraseoperation mode for the flash memory FLH with an address signal Add andinput data DI shown in FIGS. 1 and 9. In the erase operation mode, aftera memory element (or some memory elements) is selected from a pluralityof memory elements arranged in a matrix, for example, a negative wordline selective voltage is applied to a selected word line coupled to theselected memory element, and a positive bit line selective voltage and apositive source line selective voltage are applied to a selected bitline and selected source line coupled to the selected memory element.This application of voltage causes holes to be injected into a chargestorage layer of a MONOS transistor of the selected memory element,thereby lowering the threshold voltage.

In the first to fourth embodiments, while a write operation is performedon the MONOS transistor of the selected memory element MC (00), majoritycharge carriers (electrons) having the conductivity type (firstconductivity type) of the drain region D and source region S areinjected into the channel of the MONOS transistor of the unselectedmemory element MC (11) as shown in FIG. 3B. This injection allowsmajority charge carriers (holes) of the second conductivity typeaccumulated in the channel to recombine with the majority chargecarriers (electrons) of the first conductivity type, thereby reducingthe majority charge carriers of the second conductivity type accumulatedat the channel interface.

In the case where a P-type MONOS transistor is used, electrons, whichare the majority charge carriers of the first conductivity type, arestored in the channel of the P-type MONOS transistor making up theunselected memory element MC (11) during a write operation performed onthe selected memory element MC (00). Because of this, while the selectedmemory element MC (00) is being written, a word line non-selectivevoltage and a bit line non-selective voltage or/and source linenon-selective voltage that reduce the potential difference between theunselected word line WL (1) and the unselected bit line BL (1) or/andunselected source line SL (1) are produced and applied to the unselectedword line WL (1) and unselected bit line BL (1) or/and unselected sourceline SL (1). Through the voltage application, holes, which are themajority charge carriers of the second conductivity type, are injectedinto the channel of the P-type MONOS transistor. Consequently, theelectrons stored in the channel can be reduced.

In the first to fourth embodiments, the semiconductor region SOI1 wherethe channel is formed (FIG. 3) and the gate electrode G are configuredto have different work functions, and therefore a potential differenceis substantially created between the channel and gate electrode G evenif voltages are produced and applied so as to equalize the voltages onthe unselected word line WL (1) and the unselected bit line BL (1)or/and unselected source line SL (1).

However, it is possible to produce and apply a word line non-selectivevoltage and a bit line non-selective voltage or/and source linenon-selective voltage such that a potential difference is createdbetween the unselected word line WL (1) and the unselected bit line BL(1) or/and unselected source line SL (1). For example, if an N-channelMONOS transistor is used, a word line non-selective voltage that ispositive with respect to the bit line non-selective voltage or/andsource line non-selective voltage can be produced and applied in theperiods T2, T4, T6, T8, T10 shown in FIGS. 4, 6, 7, and 8. If aP-channel MONOS transistor is used, on the other hand, a word linenon-selective voltage that is negative with respect to the bit linenon-selective voltage or/and source line non-selective voltage can beproduced and applied in the periods T2, T4, T6, T8, T10 shown in FIGS.4, 6, 7, and 8.

In the first to fourth embodiments, each of the periods T1, T3, T5, T7,T9 shown in FIGS. 4, 6, 7, and 8 is set to a length of time in which thehole concentration at the channel interface is maintained such thatejection of electrons from or injection of holes into the charge storagelayer N of the unselected memory element classified as theerroneously-erasable memory element EPS does not occur. For example,each of the periods T1, T3, T5, T7, T9 is set to approximately from afew microseconds (us) to a few tens of microseconds (us).

In addition, each of the periods T2, T4, T6, T8, T10 shown in FIGS. 4,6, 7, and 8 is set to be longer than a length of time required for theholes stored at the channel interface of the unselected memory elementclassified as the erroneously-erasable memory element EPS to recombinewith the injected electrons. For example, each of the periods T2, T4,T6, T8, T10 is set to approximately from a few microseconds (us) to afew tens of microseconds (us).

The first to fourth embodiments describe that the word line selectivevoltage, word line non-selective voltage, bit line selective voltage,bit line non-selective voltage, source line selective voltage, sourceline non-selective voltage, and back gate voltage periodically change;however, the periodicity described herein does not require that thevoltages should always behave the same in each of the periods T1 to T10.Thus, the periodicity includes that the voltage value alternatelychanges.

In the first embodiment, the word line selective voltage, bit lineselective voltage, and source line selective voltage periodically changeindependently, and consequently, the potential difference between theword line selective voltage and the bit line selective voltage andsource line selective voltage periodically changes. In the same manner,the word line non-selective voltage, bit line non-selective voltage, andsource line non-selective voltage periodically change independently, andconsequently, the potential difference between the word linenon-selective voltage and the bit line non-selective voltage and sourceline non-selective voltage periodically changes. The potentialdifference between the selective voltages and the potential differencebetween the non-selective voltages increase in the period T1, butdecrease in the period T2 as seen in FIG. 4. Thus, it can be assumedthat the potential difference periodically changes. In this case, whilethe potential difference between the selective voltages is small, thepotential difference between the non-selective voltages is also small.

In the second embodiment, as shown in FIG. 6, the bit line non-selectivevoltage and source line non-selective voltage periodically changeindependently. Accordingly, the potential difference between the wordline non-selective voltage and the bit line non-selective voltage andsource line non-selective voltage periodically changes. In FIG. 6, thepotential difference between the non-selective voltages is large in theperiod T1, and is small in the period T2.

In the third embodiment, the bit line non-selective voltage or sourceline non-selective voltage periodically changes, and consequently, thepotential difference between the word line non-selective voltage and thebit line non-selective voltage (or the source line non-selectivevoltage) periodically changes. In the example of FIG. 7, the potentialdifference between the non-selective voltages is large in the period T1,and is small in the period T2. Furthermore, in the fourth embodiment,the word line non-selective voltage periodically changes, andconsequently, the potential difference between the word linenon-selective voltage and the source line non-selective voltageperiodically changes. Also as shown in FIG. 8, the potential differencebetween the non-selective voltages is large in the period T1, and issmall in the period T2.

The row decoder circuit 8, column decoder circuits 10, 13 shown in FIG.1 can be assumed as a selection circuit to select a word line, bit line,and source line. In addition, the word line bias control circuit 9, bitline bias control circuit 11, source line bias control circuit 14 can beassumed as a bias circuit to produce a selective voltage andnon-selective voltage.

Under the assumption, it can be assumed that the bias circuitperiodically changes the potential difference between the selectivevoltages (large or small). Similarly, it can be assumed that the biascircuit periodically changes the potential difference between thenon-selective voltages (large or small).

Moreover, although word lines are arranged along respective rows in amatrix, and bit lines and source lines are arranged along respectivecolumns in the matrix in the first to fourth embodiments, theembodiments are not limited thereto. For example, the word lines can bearranged along the respective columns in the matrix, and the bit linesand source lines can be arranged along the respective rows in thematrix. Although a common back gate voltage is applied to a plurality ofback gate lines BKL, this is just an example, and it is also possible toselect a desired back gate line from the back gate lines BKL and apply aback gate voltage to the selected back gate line. The threshold voltageof the memory elements can be adjusted by changing the back gatevoltage.

It should be further understood by those skilled in the art thatalthough the foregoing description has been made on embodiments of theinvention, the invention is not limited thereto and various changes andmodifications may be made without departing from the spirit of theinvention and the scope of the appended claims. For example, the presentinvention has been described in terms of a flash memory including memoryelements as an example; however, the invention is not limited thereto,and can be also applied to other types of nonvolatile memories composedof memory elements, such as EEPROM.

What is claimed is:
 1. A semiconductor device comprising: a plurality ofnonvolatile memory elements, each of which has a pair of secondsemiconductor regions arranged to sandwich a first semiconductor regionwhere a channel is formed, the second semiconductor regions being of afirst conductivity type, a gate electrode arranged above the firstsemiconductor region, and a charge storage layer arranged between thegate electrode and the first semiconductor region and storing charge,and the memory elements being arranged over a semiconductor substratewith an insulating layer interposed therebetween; and a bias circuitproducing a selective voltage to be applied to a first nonvolatilememory element of the nonvolatile memory elements and a nonselectivevoltage to be applied to a second nonvolatile memory element of thenonvolatile memory elements such that when majority charge carriers ofthe first conductivity type of the second semiconductor region arestored in the charge storage layer of the first nonvolatile memoryelement and the selective voltage is applied to the first nonvolatilememory element, the bias circuit produces the nonselective voltage to beapplied to the second nonvolatile memory element that reduces apotential difference between the gate electrode and at least one of thesecond semiconductor regions of the second nonvolatile memory element,which is different from the first nonvolatile memory element, to therebyreduce majority charge carriers of a second conductivity type of thefirst semiconductor region, which is different from the firstconductivity type, stored in the channel of the second nonvolatilememory element.
 2. The semiconductor device according to claim 1,wherein the bias circuit applies a potential difference between the gateelectrode of the second nonvolatile memory element and the secondsemiconductor region such that the majority charge carriers of the firstconductivity type of the second semiconductor region are supplied to thechannel of the second nonvolatile memory element, to recombine thestored majority charge carriers of the second conductivity type of thefirst semiconductor region with the supplied majority charge carriers ofthe first conductivity type of the second semiconductor region in thechannel of the second nonvolatile memory element.
 3. The semiconductordevice according to claim 2, wherein the gate electrode of thenonvolatile memory elements includes a semiconductor layer of the firstconductivity type, and the bias circuit equalizes a voltage on the gateelectrode of the second nonvolatile memory element and a voltage on thesecond semiconductor region.
 4. The semiconductor device according toclaim 3, wherein the first semiconductor region includes a P-typesemiconductor region, the pair of the second semiconductor regionsinclude a pair of N-type semiconductor regions, the majority chargecarriers of the first conductivity type are electrons, and the majoritycharge carriers of the second conductivity type are holes.
 5. Thesemiconductor device according to claim 1, wherein the firstsemiconductor region is in an electrically floating state, a biasvoltage is applied to the semiconductor substrate, and the bias voltageadjusts a threshold voltage of the nonvolatile memory elements.
 6. Asemiconductor device comprising: a plurality of nonvolatile memoryelements, each of which has a pair of second semiconductor regionsarranged to sandwich a first semiconductor region where a channel isformed, the second semiconductor regions being of a first conductivitytype, a gate electrode arranged above the first semiconductor region,and a charge storage layer arranged between the gate electrode and thefirst semiconductor region and storing charge, and the memory elementsbeing arranged in a matrix over a semiconductor substrate with aninsulating layer interposed therebetween; a plurality of word linesarranged along respective rows in the matrix, and coupled to the gateelectrode of the nonvolatile memory elements arranged in thecorresponding rows; a plurality of bit lines arranged along respectivecolumns in the matrix, and coupled to one of the second semiconductorregions of the nonvolatile memory elements arranged in the correspondingcolumns; a plurality of source lines arranged along the respectivecolumns in the matrix, and coupled to the other second semiconductorregion of the nonvolatile memory elements arranged in the correspondingcolumns; a selection circuit selecting a word line, a bit line, and asource line from the word lines, the bit lines, and the source lines;and a bias circuit producing a selective voltage to be applied to theselected word line, the selected bit line, and the selected source line,and a non-selective voltage to be applied to an unselected word line, anunselected bit line, and an unselected source line, and wherein, whilemajority charge carriers of the first conductivity type are being storedin the charge storage layer of a first nonvolatile memory elementincluding a gate electrode coupled to the selected word line, one of thesecond semiconductor regions coupled to the selected bit line, and theother second semiconductor region coupled to the selected source line,the bias circuit produces a non-selective voltage to supply majoritycharge carriers of the first conductivity type of the secondsemiconductor region to the channel of a second nonvolatile memoryelement including a gate electrode coupled to the unselected word line,one of the second semiconductor regions coupled to the unselected bitline, and the other second semiconductor region coupled to theunselected source line.
 7. The semiconductor device according to claim6, wherein, while the majority charge carriers of the first conductivitytype of the second semiconductor region are being stored in the chargestorage layer of the first nonvolatile memory element, the bias circuitproduces a selective voltage that periodically changes the potentialdifference and a non-selective voltage that periodically changes thepotential difference.
 8. The semiconductor device according to claim 7,wherein, when the majority charge carriers of the first conductivitytype of the second semiconductor region are supplied to the channel ofthe second nonvolatile memory element, the bias circuit equalizes thevalue of a selective voltage to be applied to the selected word line,the selected bit line, and the selected source line and the value of anon-selective voltage to be applied to the unselected word line,unselected bit line, and unselected source line.
 9. The semiconductordevice according to claim 6, wherein the bias circuit produces anon-selective voltage that periodically changes the potential differencein a period in which the bias circuit produces a selective voltage tostore the majority charge carriers of the first conductivity type of thesecond semiconductor region in the charge storage layer of the firstnonvolatile memory element.
 10. The semiconductor device according toclaim 9, wherein the bias circuit produces a non-selective voltage thatperiodically reduces the potential difference between a non-selectivevoltage applied to the unselected word line and a non-selective voltageapplied to the unselected bit line, in a period in which the majoritycharge carriers of the first conductivity type of the secondsemiconductor region are being stored in the charge storage layer of thefirst nonvolatile memory element.
 11. The semiconductor device accordingto claim 9, wherein the bias circuit produces a non-selective voltagethat periodically reduces the potential difference between anon-selective voltage applied to the unselected word line and anon-selective voltage applied to the unselected source line in a periodin which the majority charge carriers of the first conductivity type ofthe second semiconductor region are being stored in the charge storagelayer of the first nonvolatile memory element.
 12. The semiconductordevice according to claim 9, wherein the bias circuit produces anon-selective voltage that periodically reduces the potential differencebetween a non-selective voltage applied to the unselected word line anda non-selective voltage applied to the unselected bit line and thepotential difference between a non-selective voltage applied to theunselected word line and a non-selective voltage applied to theunselected source line in a period in which the majority charge carriersof the first conductivity type of the second semiconductor region arebeing stored in the charge storage layer of the first nonvolatile memoryelement.
 13. The semiconductor device according to claim 9, wherein thefirst semiconductor region of the nonvolatile memory elements is in afloating state, and a bias voltage is applied to the semiconductorsubstrate to adjust a threshold voltage of the nonvolatile memoryelements.
 14. A semiconductor device comprising: a plurality ofnonvolatile memory elements, each of which has a first semiconductorregion where a channel is formed and being in an electrically floatingstate, a pair of second semiconductor regions arranged to sandwich thefirst semiconductor region, the second semiconductor regions being of afirst conductivity type, a gate electrode arranged above the firstsemiconductor region, and a charge storage layer arranged between thegate electrode and the first semiconductor region and storing charge;and a bias circuit producing a selective voltage to be applied to afirst nonvolatile memory element of the nonvolatile memory elements anda nonselective voltage to be applied to a second nonvolatile memoryelement of the nonvolatile memory elements such that when majoritycharge carriers of the first conductivity type of the secondsemiconductor region are stored in the charge storage layer of the firstnonvolatile memory element and the selective voltage is applied to thefirst nonvolatile memory element, the bias circuit periodically producesthe nonselective voltage to the second nonvolatile memory element thatperiodically reduces a potential difference between the gate electrodeand at least one of the second semiconductor regions of the secondnonvolatile memory element, which is different from the firstnonvolatile memory element, to periodically supply majority chargecarriers of the first conductivity type of the second semiconductorregion to the channel of the second nonvolatile memory element tothereby reduce majority charge carriers of a second conductivity type ofthe first semiconductor region, which is different from the firstconductivity type, stored in the channel of the second nonvolatilememory element.
 15. The semiconductor device according to claim 14,wherein the gate electrode of the nonvolatile memory elements includes asemiconductor layer of the first conductivity type, and the bias circuitequalizes a voltage to be applied to the gate electrode of the secondnonvolatile memory element and a voltage to be applied to the secondsemiconductor region.
 16. The semiconductor device according to claim15, wherein the first semiconductor region includes a P-typesemiconductor region, the pair of the second semiconductor regionsinclude a pair of N-type semiconductor regions, the majority chargecarriers of the first conductivity type are electrons, and the majoritycharge carriers of the second conductivity type are holes.